IRF640 N-channel MOSFET (200V, 18A) Original

25,00 EGP

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Description

The IRF640 is a N-channel MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) commonly used in high-power switching and amplification applications. Below is the detailed datasheet-style information for the IRF640 MOSFET.

IRF640 N-Channel MOSFET Datasheet

General Description:

The IRF640 is a powerful N-channel MOSFET with high-voltage and high-current capabilities, designed for power switching applications. It’s widely used in industrial, automotive, and power supply applications.


Key Specifications:

ParameterValue
TypeN-channel MOSFET
Drain-Source Voltage (V_DS)200V
Gate-Source Voltage (V_GS)±20V
Continuous Drain Current (I_D)18A
Pulsed Drain Current (I_DM)60A
Total Power Dissipation (P_D)80W
Gate Threshold Voltage (V_GS(th))2V – 4V
R_DS(on) (On-Resistance)0.18Ω
Gate Charge (Qg)120nC

Electrical Characteristics:

ParameterTest ConditionsValue
Drain-Source Voltage (V_DS)200V
Gate-Source Voltage (V_GS)±20V
Continuous Drain Current (I_D)T_A = 25°C18A
Pulsed Drain Current (I_DM)60A
Gate Threshold Voltage (V_GS(th))V_DS = V_GS, I_D = 250µA2V – 4V
On-Resistance (R_DS(on))V_GS = 10V, I_D = 10A0.18Ω
Gate-Source Leakage Current (I_GS)V_GS = ±20V±100nA
Drain-Source Leakage Current (I_DSS)V_DS = 200V, V_GS = 0V1µA (Max)
Total Gate Charge (Qg)V_DS = 100V, V_GS = 10V120nC
Gate-Source Leakage Current (I_GS)V_GS = ±20V±100nA

Thermal Characteristics:

ParameterValue
Junction-to-Case Thermal Resistance (R_θJC)1.0°C/W
Junction-to-Ambient Thermal Resistance (R_θJA)62.5°C/W
Maximum Junction Temperature (T_J)150°C
Storage Temperature Range (T_stg)-55°C to +150°C

Package Information:

  • Package Type: TO-220
  • Pin Configuration (TO-220):
    1. Gate (G): Control terminal for switching the MOSFET on/off.
    2. Drain (D): The main current-carrying terminal, connected to the load.
    3. Source (S): The terminal connected to the reference or ground.
  • Mounting Type: Through-hole
  • Weight: Approx. 2.5g

Application Notes:

The IRF640 is ideal for high-power, high-voltage switching applications. It is widely used in:

  • Power Supplies: As a switching element in SMPS (Switched-Mode Power Supplies).
  • DC-DC Converters: Used for high-current power conversion applications.
  • Motor Drivers: Control of DC motors and stepper motors.
  • Amplifiers: Audio amplifiers or other power amplifiers.
  • Automotive Applications: Power control circuits and inverters.

Advantages:

  • Low On-Resistance: Ensures efficient switching with minimal power loss during operation.
  • High Current Handling: Capable of handling up to 18A continuously with low thermal dissipation.
  • Low Gate Charge: Enables fast switching, making it suitable for high-speed applications.
  • High Voltage Rating: Can operate at up to 200V drain-source voltage.

Safety and Handling:

  • Thermal Management: It is essential to use a heatsink when operating near maximum power dissipation values (especially for high-current switching).
  • ESD Protection: Handle with care to avoid electrostatic discharge (ESD) damage to the gate.
  • Proper Gate Drive: Ensure that the gate voltage is properly controlled to avoid overdriving the gate and causing damage.

 

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